Cellecta 20mm Foil-Faced Underfloor Heating Insulation Board XFLO® FF 250 – High Strength XPS with Thermal Diffusion

20mm Foil-Faced Underfloor Heating Insulation Board – High Strength XPS (250kPa) with Thermal Diffusion Channels

Extended Product Description: The 20mm Foil-Faced Underfloor Heating Insulation Board is a premium, fully foil-faced extruded polystyrene (XPS) solution engineered specifically for efficient and responsive underfloor heating (UFH) systems. Manufactured using CO2-blown technology for a lower environmental impact, this high-performance board combines exceptional compressive strength with advanced thermal properties to deliver outstanding results in both domestic and commercial installations.

Key to its performance is the full aluminium foil facing (including inside the routed channels), which significantly improves heat diffusion across the floor surface. This ensures even heat distribution, faster warm-up times, and reduced energy consumption — making it ideal for modern low-temperature heat sources such as heat pumps.

With a compressive strength of 250 kPa at 10% compression, the board withstands heavy foot traffic, installation loads, and long-term use without deformation. The low thermal conductivity of 0.033 W/mK provides excellent insulation, minimizing downward heat loss and maximizing upward heat transfer into the room.

Custom routing options allow precise accommodation of UFH pipes (diameters 10mm, 12mm, 15mm, 16mm) at common centres (150mm, 200mm, 300mm), with return styles including Arch (default) or Tulip for flexible layout design. Standard board sizes of 600 x 1250mm (600 x 2500mm available on request) make handling and cutting straightforward on site.

This 20mm thickness variant is particularly suited to projects where floor height build-up needs to be minimized while still achieving high thermal efficiency. When paired with a suitable overlay like screed boards or self-leveling compounds, it creates a fast-response heating floor ideal for new builds, refurbishments, extensions, conservatories, and retrofit applications over timber joists or concrete subfloors.

Technical Specifications Summary (20mm version):

• Material: CO2-blown extruded polystyrene (XPS) with full foil facing
• Compressive Strength: 250 kPa at 10% compression
• Thermal Conductivity: 0.033 W/mK
• Thickness: 20 mm (standard for this variant)
• Board Sizes: 600 x 1250 mm or 600 x 2500 mm
• Pipe Route Diameters: 10 mm, 12 mm, 15 mm, 16 mm
• Pipe Centre Options: 150 mm, 200 mm, 300 mm
• Return Style Options: Arch (default), Tulip
• Minimum Order Quantity: 1 board
• Recommended Accessory: Thermal perimeter edge strip for full system performance

We supply the full range of Cellecta underfloor heating insulation products from our partner Cellecta

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